Transphorm and Weltrend Semiconductor Launch Integrated Gallium Nitride System-in-Packages
Transphorm and Weltrend Expand GaN SiP Family for Next-Generation Power Adapters
BonChip Electronics, a leading distributor of power management solutions, is excited to announce the expansion of the industry's first GaN System-in-Package (SiP) family from Transphorm and Weltrend Semiconductor. This groundbreaking collaboration delivers innovative GaN-based solutions for designing smaller, faster-charging, and more efficient power adapters.
Introducing the WT7162RHUG24B and WT7162RHUG24C SiPs
Building upon the success of their initial GaN SiP launched last year, Transphorm and Weltrend unveil two new additions to the family:
- WT7162RHUG24B: Integrates Weltrend's high-frequency multi-mode Flyback PWM controller with Transphorm's 150 mΩ SuperGaN FET, offering exceptional performance for diverse applications.
- WT7162RHUG24C: Combines Weltrend's controller with Transphorm's 480 mΩ SuperGaN FET, catering to applications requiring a balance between efficiency and cost-effectiveness.
Enhanced Features for Streamlined Design
These new SiPs inherit the innovative features of their predecessor, the WT7162RHUG24A, while introducing additional functionalities:
- UHV Valley Tracking Charge Mode: Optimizes charging efficiency for a wider range of input voltages.
- Adaptive OCP Compensation: Ensures accurate over-current protection (OCP) for enhanced reliability.
- Adaptive Green Mode Control: Improves light-load efficiency for lower power consumption in standby mode.
These features empower engineers to design high-quality power supplies with fewer components, accelerating development cycles and simplifying design complexity.
Unparalleled Performance and Flexibility
The complete GaN SiP family, powered by Transphorm's SuperGaN platform and Weltrend's leading controller technology, offers compelling advantages:
- Wide Power Range: Supports a broad spectrum of applications, from low-power 30-watt USB-C PD adapters to high-performance chargers exceeding 200 watts.
- Reduced Bill-of-Materials (BOM): Simplifies design by integrating essential components, minimizing cost and board space.
- Fast Charging: Enables rapid charging for mobile devices and other electronics.
- Higher Power Outputs: Delivers the power handling capability required for demanding applications.
- "One-Size-Fits-All" Potential: Supports the development of versatile chargers with multiple ports and connection types.
- Smaller, Lighter Form Factor: Reduces adapter size and weight for improved portability.
Transphorm's SuperGaN Advantages
Transphorm's GaN technology brings inherent benefits to the SiP family:
- Best-in-Class Robustness: Provides exceptional tolerance for voltage fluctuations and noise, ensuring reliable operation.
- Unmatched Reliability: Delivers superior reliability with a failure rate of less than 0.05 FIT.
- Increased Power Density: Enables the development of more compact and efficient power adapters compared to silicon solutions.
Weltrend's SiP Design Expertise
Weltrend's innovative SiP design expertise contributes significantly to the overall solution:
- Plug-and-Play Simplicity: Minimizes design complexity and learning curves for rapid development.
- Reduced Form Factor: Contributes to the development of smaller and lighter power adapters.
BonChip Electronics: Your Partner for GaN Power Solutions
As a leading distributor of Transphorm and Weltrend products, BonChip Electronics offers the complete range of GaN SiP solutions. Our team of experts is dedicated to assisting you in selecting the optimal SiP for your specific power adapter design requirements. Contact BonChip Electronics today to learn more about how Transphorm and Weltrend's GaN SiP family can empower you to create next-generation power adapters with exceptional performance and efficiency.
Mots clés:
Transphorm,
Weltrend Semiconductor,
GaN,
SiP,
System-in-Package,
USB PD,
power adapter,
AC-to-DC,
power supply
