TI Introduces Compact Magnetic Packaging for New Power Modules
Texas Instruments Unveils Groundbreaking MagPack Power Modules: Smaller, Cooler, and More Efficient
Texas Instruments (TI) has revolutionized the power supply landscape with the introduction of its innovative MagPack packaging technology. This groundbreaking advancement delivers a family of six new DC-DC power modules boasting significant improvements in size, thermal performance, electromagnetic interference (EMI), and efficiency. BonChip Electronics, a trusted distributor for TI, is proud to offer these industry-leading power modules to our customers.
TI says the new MagPack power modules deliver best-in-class W/mm2.
Unmatched Size Reduction and Efficiency Gains:
- Up to 50% Smaller Footprint: Compared to previous generations of TI modules, the MagPack family achieves a remarkable size reduction of up to 50%. This translates to smaller, lighter end products and increased design flexibility.
- World's Smallest 6A, 5V Power Module: The new modules establish a new benchmark in size, delivering a footprint of a mere 6.9 mm2 while generating an impressive 6A at a 5.5V output. This translates to a near 1 Amp per 1 mm2 of valuable PCB real estate.
- Superior Efficiency: MagPack modules offer efficiency improvements of up to 2% compared to competing solutions, minimizing power losses and heat generation within your design.
Enhanced Thermal Performance and Reduced EMI:
- Lower Junction-to-Ambient Thermal Resistance: TI's innovative design and packaging techniques deliver a lower junction-to-ambient thermal resistance (RΘJA) compared to traditional power modules. This translates to more efficient heat dissipation, allowing your power supply to operate cooler and with greater reliability.
- Optimized Internal Routing: MagPack modules eliminate internal bond wires, replaced by optimized internal routing. This not only improves RΘJA but also minimizes parasitic resistance and inductance for superior electrical performance.
- Integrated, Matched Inductor: Each module features an internal inductor specifically matched to the silicon die. This optimizes both AC and DC loss factors, simplifies the design process, and reduces component count.
- Reduced EMI Emissions: The specialized packaging and integrated inductor construction contribute to an impressive 8 dB reduction in EMI emissions, ensuring your design meets critical noise regulations.
MagPack includes an internal inductor and external capacitors, delivering a much smaller footprint than other packaging systems with external inductors.
Simplified Design and Manufacturing:
- Focus on Core Functionality: MagPack modules focus on delivering core power conversion functionality, leaving the selection and placement of input and output capacitors to the designer. This provides flexibility to choose the optimal components for your specific application.
- Reduced Design Time: The integration of the inductor eliminates the need for sourcing and integrating a separate component, streamlining the design process and shortening development cycles.
- Simplified Bill of Materials (BOM): By integrating the inductor, MagPack modules minimize the number of required components, reducing BOM complexity and potentially lowering manufacturing costs.
MagPack: A Revolution in Power Supply Design:
"Innovative packaging is radically reshaping our industry and is something we believe is key to the next frontier of power innovation," stated TI product line manager Roja de Cande. "With a new approach to packaging, our power modules enable designers to achieve previously impossible levels of performance in a world where space allocated to power is shrinking year over year."
BonChip Electronics: Your Trusted Source for MagPack Power Modules
BonChip Electronics is your one-stop shop for all your TI power supply needs, including the revolutionary MagPack family. We offer exceptional customer service, fast delivery times, and the technical expertise to assist you in selecting the optimal power module for your next project. Contact BonChip Electronics today to learn more about how MagPack can transform your power supply design!
Mots clés:
Texas Instruments,
TI,
MagPack,
power supply module,
DC-DC converter,
size reduction,
efficiency,
thermal performance,
EMI
